All-in-One PCB

We provide a wide range of PCB Assembly Services for various products and industries based on cutting-edge automation and processes including POP – Package on Package, 01/005 Components, Micro BGAs, Flexible PCBs, Multi-Layered Prints, and more. Our services span from PCBA Assembly and mechanical assembly through integration and ICT,J-TAG, and final testing of PCBA, complete systems, and products. Also available – Acrylic coating by a fully automatic machine, Potting, Ultrasonic soldering, and DfM.
Whether you need a low volume or a high volume of PCBs, you’ll always receive the same high standards of quality from our certified manufacturing facility (ISO9001/ISO14001/ISO13485). All PCB Technologies solutions are assembled by certified experts (IPC-A-610 and J-STD-001.

Advanced System-in-Package (SiP) solutions are multi-component, multifunction products that leverage PCB Technologies’ core strengths in order to offer our customers higher levels of miniaturized integration with reduced lead times. These include:

• Packaging solutions
• Size reduction
• High thermal conductivity
• Ultra-thin with fine lines & spacing
• Controlled CTE
• 3D design
• Shielding options
• Sealing solutions
• Fine pitch flip-chip and copper pillar
• Double side assembly
• Development & production testing
• Turnkey solutions

We offer a high-efficiency All-in-One Solution, resulting in brighter ideas and better-quality products at significantly shorter lead times. Our advanced R&D center, located within the same large complex as our manufacturing facilities, allows for the seamless creation of custom SiP; from design to manufacture, assembly, and testing.

An entire suite of Design for Manufacturing (DfM) services that expertly analyze PCB designs with the aim of improving quality, yields, and delivery times while also reducing costs. 

• Careful evaluation identifies potential setbacks early in the PCB design stage, where we waste no time in recommending alternative methods to help boost quality, lower costs, and speed up TTM. 
• Our DfM engineering analysis examines the PCB production process layer by layer, checking out all available options, such as reducing the number of layers or consolidating components in order to cut costs sensibly and responsibly. 
• By conducting post-build reviews after every production cycle, we reveal additional methods of streamlining manufacturing for better yields at lower costs.

Design for Testability (DfT) services help to identify possible snags with PCB designs before starting mass production, minimizing defects while maximizing reliability and repeatability.

The In-Circuit Test (ICT) can pinpoint defects in the board from the assembly process, such as component mismatches, misplacements, or missing components. PCB Technologies also delivers functionality tests, whereby PCBs are tested in their final production environment to ensure proper functionality according to specs.

Our Value Analysis/Value Engineering (VA/VE) solutions enable customers to gain the maximum value from their PCB designs. Unlocking greater product value through continuous improvements is facilitated by combining our services: Design for Manufacturing (DfM), Design for Testability (DfT), Design for Procurement (DfP), Design for Cost (DfC), and Design for Assembly (DfA). 

PCB Technologies works hand-in-hand with customers not only to improve existing PCB designs but also to support clients’ new product designs, from launch through scaling-up production and long-term management.

With a long history of cutting-edge PCB design expertise, coupled with top-tier production capabilities, our customers rely exclusively on PCB Technologies for their PCB Full Turnkey projects.

We utilize the latest technologies and automation equipment to create high-quality production processes; tailored to the product requirements. Solutions involve all aspects of assembly — efficiently transforming part integration, cabling, and electronics, into modules or end products. Customers also benefit from our broad market purchasing power in sourcing the best components at cost-effective prices.