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Miniaturization (iNPACK) - Organic Substrates & Advanced IC Packaging Solutions
Explore SolutionsHDI boards, PCBA with BGA connectors, RF, and Rigid-Flex
High reliability, high-speed & high-density interconnect PCBs
High-reliability, high-quality PCBs - prototype to Low/Mid production volumes
HDI, Rigid/Rigid-Flex, RF boards, heat management solutions, and more
Supporting high reliability of your products and their long-term usage
Advanced PCB & miniaturization solutions compatible with high quality standards
SMT, substrate design & manufacturing, advanced materials and more
High-reliability, high-performance communication PCBs ensuring signal integrity
Superior heat dissipation, organic substrate and advanced packaging solutions
Our highly experienced engineering team is at your service – from design to fabrication for an All-in-One solution
Our sales team will be happy to provide you with a quote. Simply send us an email detailing your requirements and we’ll reply ASAP
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Learn about the Critical Core Component in Medical Devices & Equipment, by PCB Technologies.
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Learn about our advanced PCB design solutions offering high-performance Thermal Management options for Radio Frequency & Microwave applications.
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PCBs are the first heat management platform that electrical components meet. How you choose to handle the heat very much depends on the power dissipated from constituent components, line losses, board design, circuit editing, and mechanical structure. There are also thermal effects that arise from interconnect options on the board level, vias, transmission lines and assembly pad design.
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