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MEET US @ THE IMAPS CONFERENCE / EXHIBITION

iNPACK, a PCB Technologies company

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17th September ,2024


iNPACK – HOME OF HIGH-END SOLUTIONS 

Schedule a Meeting – see below

JOIN US AT THE IMAPS CONFERENCE / EXHIBITION

Visit the iNPACK Booth, #507 where there’s so much to see and a terrific tech-team to connect with.

Check out the unique IC packaging solutions + processes, materials, components, & innovative technology designed to answer your needs:

  • High Performance / High Reliability
  • Top-level IC Packaging Solutions (Flip Chip, 2.5D, 3d & more)
  • Advanced Fab. & Assy. Processes (high efficiency, time & cost saving)
  • Custom Substrate Design Options

We look forward to meeting you! Schedule a meeting now.

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