Microelectronics

Our offering of organic substrates of High-Density Line/Space width and advanced packaging allows for smaller form factor and increased functionality, high thermal conductivity, and process stability.

SiP (System in Package) prototype or low/mid volumes production – highly compatible with consumer electronics, telecommunications, aerospace, defense, medical, and other industries’ needs is our core business.
Our specialization in miniaturization and heat dissipation solutions will assure your device high performance and reliability in the shortest time to market possible.