Substrates

iNPACK’s expert offering includes advanced organic substrate and enhanced micro-electronics packaging technologies. This enables us to deliver comprehensive substrate panel-level manufacturing and engineering support to our customers, helping them to miniaturize their systems. We work to improve the interconnections between the PCB, substrate, and semiconductors through advanced technologies, creative solutions, and improved design flexibility. We aim to deliver high-speed, thermal, and RF paths that simplify the integration process. This also has the benefit of improving system reliability.