Chip On Board

Mounting bare semiconductors and their wires to the PCB’s surface while using conductive or non-conductive adhesives, ball bonding, aluminum wedge bonding or die attached, for electrical connection is one of our specialties. Our processes enable high throughputs at high reliability, which derives from a stable bonding process, and translate into enhanced yield.
Our COB technology guarantees low wire bonding loop profile, higher reliability, and advanced capability to support high I/O.

See also: Die Stacking, IC Packaging, PCB Thermal Management