Enhanced capacity for precise and speedy production

PCB Technologies is gearing up. The ever-growing demand for High-Density Interconnect requires speedy and cost-effective production processes. Our newest addition – the advanced #Excellon’s Cobra #laser system featuring UV and CO2 laser capabilities, helps us meet this challenge. The system has a CCD camera that maximizes the accuracy of the drill positioning. Once fine alignment is complete micro vias are formed, using CO2 & UV alternately, per the row material/application.

The clean & sharp ablation drilling enables robust & uniform via plating for electrical conductivity (HDI). It all adds to an All-in-One leading technological solution based on increased reliability, high quality, and high resolution. A few examples are in the pictures below.

Sample 4-18, 10 mil drill buried vias 3-16

HDI 3 X sequential lamination X-axis cross section top row of stacked on buried vias (10 mil drill)

HDI 3 X sequential lamination X-axis cross section top row of stacked on buried vias (10 mil drill)