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MEET US @ APEC 2025

iNPACK, a PCB Technologies company

|

13th March ,2025

Click here to schedule a meeting

 

Visit the iNPACK Booth, #2244 where there’s so much to see and a terrific tech-team to connect with.

  • High Performance / High Reliability
  • Top-level IC Packaging Solutions (Flip Chip, 2.5D, 3d & more)
  • Advanced Fab. & Assy. Processes (high efficiency, time & cost saving)
  • Custom Substrate Design Options

We look forward to meeting you! Schedule a meeting now.

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