Talk to an Expert

LET'S TALK

PCB Technologies > Events > Miniaturization technology – Controlling thermal expansion and power dissipation

Miniaturization technology – Controlling thermal expansion and power dissipation

ALON MENACHE

|

20th January ,2022

Chip packaging technology becomes a key factor enabling smaller, lighter systems with increased functionality for various applications (automotive, aerospace, medical industrial, and others). To ensure system reliability and space reduction, the package should comply with several thermal, mechanical, and electrical requirements. PLS follow the link to a recently published article for further information.

Dense BGA

HDI fine pitch of 0.1

Heat sink

Share

You May Also be Interested in

articles

In-house HATS (Highly Accelerated Thermal Shock) lab- Evaluating reliability for extended survivability

Coins insert – the advanced heat dissipation method for cooling electronic devices

Extreme heat dissipation solution in PWB stage

The challenge at hand was providing the customer with an extreme heat dissipation-resistant PCB, to be installed in an electronic device releasing a large amount of heat during its operation, thus utilizing the PCBs as a cooling system.

Thank you

We will contact you shortly