Panel-Level Packaging vs. Wafer-Level Packaging

Unpacking the Future of Advanced Semiconductor Solutions with iNPACK

In the fast-paced world of electronics, miniaturization, cost-efficiency, and performance optimization are critical. Advanced packaging technologies—Panel-Level Packaging (PLP) and Wafer-Level Packaging (WLP)—are driving this evolution. Choosing the right approach significantly impacts production efficiency, scalability, and cost. With its expertise in panel-level solutions, iNPACK offers a distinct advantage.

Panel-Level Packaging (PLP): Efficiency at Scale

Panel-Level Packaging (PLP) utilizes rectangular panels similar to organic substrate manufacturing, designed specifically for high-volume production. This innovative approach boosts efficiency, reduces costs, and introduces the flexibility of MCM/SiP assembly. By leveraging a simplified process, working with known good dies, and optimizing product functionality with the best available technology for each required function, PLP delivers exceptional performance and value.

Key Advantages:

• • Enhanced batch yields with rectangular panels, minimizing material waste.
  • Tested and verified known good dies, leading to improved production yield.
  • Supports advanced designs, including System-in-Package (SiP) and heterogeneous integration solutions.
  • Highly cost-effective for industries such as automotive and aerospace systems.
  • Incorporates 3D design options and integrates passive components for added functionality.

Wafer-Level Packaging (WLP): Precision and Form factor driven

WLP involves packaging semiconductor dies directly on the wafer before dicing. This streamlined process supports fan-in designs, reduces handling and enables smaller form factors.

Key Applications of Wafer-Level Packaging :

• • Ideal for compact devices including single-die RF and digital components.
  • Facilitates mass production by bypassing substrate design and directly using RDL layers  

Key Advantages:

• • Reduces form factor
  • Minimizes Production handling
  • Provides an advanced Chip-Scale Packaging (CSP) solution

Limitations:

• • Scalability is restricted by the wafer circular dimensions.
  • Primarily supports single-die solution

Wafer-Level Packaging Structure:

Comprehensive Comparison Table

Feature	Panel-Level Packaging	Wafer-Level Packaging
Process overview	Processes multi chips on a panel	Processes a single chip on wafers
Form factor	Rectangular or square panels	Circular wafers
Cost efficiency	High volume for SiP	High volume for  single-die
Production volume capability	Scales well in mass production	Limited scalability due to wafer size
Manufacturing flexibility	Supports diverse design needs	Best for compact device designs
Size limitation	Accommodates large substrates	Constrained by wafer diameter
Typical applications	Automotive, aerospace, consumer electronics	Automotive, aerospace, consumer electronics
Time to market	Faster for SiP designs	Faster for prototypes and high-volumes single-die
Quality & reliability	High with advanced penalization techniques	Limited by chip yield
Equipment requirements	Requires specialized panel tools	Relies on existing fab capabilities

Applications and Innovation: Where PLP Excels

Panel-Level Packaging is the go-to choice for industries that require both high-volume production and advanced design flexibility:

• • Automotive: Supporting advanced systems for connectivity, performance, and safety.
  • Medical Devices: Ensuring compact, life-critical electronics like wearables and monitoring tools are reliable.
  • Consumer Electronics: Powering miniaturized, high-performance devices for next-gen technologies like smartphones and IoT components.

iNPACK’s Panel-level Solution

iNPACK redefines production efficiency with its panel-level packaging solutions:

• • Panel Processing: Supports 100×200 mm² panels for large-scale, efficient production.
  • Substrate Solutions: Solve thermal expansion mismatches and signal integrity challenges.
  • SiP Expertise: Integrates SMT, micro assemblies, and 3D interconnects to achieve compact, functional designs.
  • Precision Manufacturing: Achieves 25µm lines and spacing to meet next-gen miniaturization standards.
  • Quick Turnaround: Streamlined design-to-production reduces time-to-market without sacrificing quality.

iNPACK: Your Innovation Partner

iNPACK delivers advanced packaging solutions that optimize manufacturing processes, reduce costs, and drive next-generation designs to market.

Ready to transform your packaging capabilities?
Contact iNPACK today and discover how our Panel-Level Packaging solutions can revolutionize your production processes and fuel your innovation.