PCB Technologies’ new miniaturization capabilities

In the last two years, the company has strengthened its technological leadership in circuit manufacturing. Recently we announced the capability of producing conductors with a width and spacing of 25 microns (1 mil). This is an additional capability the company has developed as part of its roadmap to miniaturization. It enables our customers to plan, produce and assemble smaller and denser circuits, giving the PCB much greater functionality than ever before.

Learn about PCB Technology, QFN Package Types and IC Packaging. 

Read more at the following link (written in Hebrew):
https://cld.bz/jYhUguo/24