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Coins insert – the advanced heat dissipation method for cooling electronic devices

Coins insert – the advanced heat dissipation method for cooling electronic devices

Thermal management in PCBs is a key competence when serving the electronics industry. A heat dissipation solution, which does not involve adding footprint or height to your PCB but does enable selective cooling of your electronic device, requires know-how and expertise.

PCB Technologies offers five methods that provide such solutions: the use of special materials, thick copper, thermal vias, heat sink (inner and outer) and the most advanced of all – the use of coins. PCB Technologies utilizes two main coin insert techniques – lamination and pressure penetration. In both cases, surface leveling is maintained, as per your requirement.
For more information, don’t hesitate to contact us.

 

All in One at all levels -repeatability, lead-time & original design v. final product

All in One at all levels -repeatability, lead-time & original design v. final product

PCB Technologies is enhancing its capacity with a new, state of the art, CNC routing machine. The machine, equipped with CCD cameras, ensures high level of #milling accuracy.

The cameras enable a precise placement of the mechanical milling, hence maintaining tight tolerance, which reduces errors in the routing process. As a result you get higher repeatability, decreased lead-time and improved accuracy when comparing the final product to the PCB’s original design.

The machine’s additional feature is a 2nd measuring system to allow greater depth control during milling (Z Axis) as well as highly accurate depth drilling and milling. If you add the machine’s high operation speed to the equation, you get higher production rate.

Who could ask for more?

A new back drill technique guarantees increased depth control and tolerance

A new back drill technique guarantees increased depth control and tolerance

With today's ever-growing demand on electronic systems, PCBs are required to be more complex with a greater number of features, while at the same time cheaper. We are in constant pursuit after improved signal integrity, fewer press lamination cycles, reduced lead times and high-level of drill accuracy. 

PCB Technologies has embraced a new solution and took it to the next level. A unique depth drill technique, based on fine tuning of the Z axis, by utilizing new machinery equipped with CCD camera. This method guaranties our customers the value of increased depth control and tolerance. As a result we facilitate minimized dialectical distance (5-7 mil.), which, in turn, decreases the stub length (4-6 mil.) and ensures back drill diameter equalizing to the finish drill size + 4 mil.

The process features also a designated measuring system that enables greater control of the drilling depth. This, in turn, increases the accuracy of the back drilling process.