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Solid data management – key to accurate quotes

Solid data management – key to accurate quotes

 

The data you collect and analyze and the insights it provides can turn decision–making into a more straightforward, knowledge-based task. When it comes to pricing, the impact it holds on the profitability of any company is even more crucial. PCB Technologies utilized SAS’ JMP statistical software supporting its customers’ need for a quick, reliable quote.

If you wish to avoid situations in which brilliant ideas get tossed away due to heavy spending predicaments or poor ones embraced due to a lack of understanding regarding their actual cost, PLS read the article in the following link. The report, published lately on I-Connect’s November issue, can get you acquainted with how we improve the pricing process while using past performance statistics to our customers’ advantage. Design007 Magazine - Design007, Nov2021

 

Innovation at its best – Packaging solutions at the COMCAS conference

Innovation at its best – Packaging solutions at the COMCAS conference

Yaniv Maydar, PCB Technologies V.P. of R&D and Innovation, attended COMCAS, one of IEEE's prime conferences, held in Tel-Aviv.

The conference allows IEEE's community members to share innovative processes in the microwaves field. Yaniv introduced our vision for future packaging solutions to shift from PCB to substrate production and expand our interconnection capabilities.

 

Our All-in-One approach supplies assembly-substrate-PCB interfaces for both design and manufacturing, all under the same roof. You're welcome to get in touch, and we'll be happy to share our solutions for an innovative sub-panel-level packaging approach.

 

Enhanced capacity for precise and speedy production

Enhanced capacity for precise and speedy production

 

PCB Technologies is gearing up. The ever-growing demand for High-Density Interconnect requires speedy and cost-effective production processes. Our newest addition – the advanced #Excellon’s Cobra #laser system featuring UV and CO2 laser capabilities, helps us meet this challenge. The system has a CCD camera that maximizes the accuracy of the drill positioning. Once fine alignment is complete micro vias are formed, using CO2 & UV alternately, per the row material/application.

The clean & sharp ablation drilling enables robust & uniform via plating for electrical conductivity (HDI). It all adds to an All-in-One leading technological solution based on increased reliability, high quality, and high resolution. A few examples are in the pictures below.

 

Sample 4-18, 10 mil drill buried vias 3-16

 

 

HDI 3 X sequential lamination X-axis cross section top row of stacked on buried vias (10 mil drill)

 

 

3 X stacked microvia after 6 X thermal shock@ 550 deg F.