Home / PCB News / Coins insert – the advanced heat dissipation method for cooling electronic devices
Coins insert – the advanced heat dissipation method for cooling electronic devices

Coins insert – the advanced heat dissipation method for cooling electronic devices

Thermal management in PCBs is a key competence when serving the electronics industry. A heat dissipation solution, which does not involve adding footprint or height to your PCB but does enable selective cooling of your electronic device, requires know-how and expertise.

PCB Technologies offers five methods that provide such solutions: the use of special materials, thick copper, thermal vias, heat sink (inner and outer) and the most advanced of all – the use of coins. PCB Technologies utilizes two main coin insert techniques – lamination and pressure penetration. In both cases, surface leveling is maintained, as per your requirement.
For more information, don’t hesitate to contact us.