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PCB Technologies > Communications

Communications

High-reliability, high-performance communication PCBs ensuring signal integrity

PCB Technologies’ design and fabrication capabilities are just what customers in search of cost efficient electronic communication devices manufacturing are looking for. The latest trend of 5G and 6G technologies affect applications, such as mobile products, portable consumers, servers, data centers, antennas, communication centers transmitters, receivers, etc., for a variety of industries, such as aviation, consumers, automotive, and medical. We provide large format panels maximizing the utilization of high aspect ratio plating.

We specialize in RF and Microwave based PCBs, essential for supporting these types of products. We supply high reliability, high-performance communication PCBs ensuring signal integrity throughout the product’s lifecycle, without any transmission delay or latency. We provide solutions for impedance issues and use various blind, buried, or micro via structures as a means for device miniaturization requirements. When relevant to the device at hand we can also offer HDI, Rigid, Flex, and Rigid-Flex fabrication solutions. We follow the strictest quality standards and conduct numerous automated tests and inspection procedures to ensure we supply the best products possible.

See also: iNPACK, Slp PCB, Substrate like PCB, Slp Process

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Relevant Applications

Sensors

There are numerous types of sensors that require PCB design and fabrication – flow, image, level sensors, light, motion, position and temperature sensors to name a few. All of which rely on heavy-data transmissions and analysis gathered from the environment, manufacturing assets and equipment. Designing PCB for these types of sensors needs to take different parameters into account, such as the environment in which they operate, their form factor, power requirements, to ensure signal and power integrity at all times for their smooth functionality as well as cost, sensitivity, reliability, and rapidity of data. Our expertise in substrate design and fabrication allows for high precision miniaturized sensors applying minimum trace spacing, and width.
Antenna in Package

Chip packaging technology has become a key factor enabling smaller, lighter systems with increased functionality. When Radio Frequency integrated circuit (RFIC) chip is placed inside a package and connected to other components, this antenna-in-package (AiP) concept enables the reduction of the overall size and weight of the system and increases its cost efficiency. We at PCB Technologies can give our customers the benefit of a decade-long PCB and PCBA experience to be implemented in miniaturization solutions as well.
Wide range of Application in package adopted by chip developer for high-frequency applications from 60 GHz radios, to automotive radars, to phased arrays, to advanced sensors at 160 GHz up to 20 GHz for special applications.
GPS Systems

Incorporating GPS (Global Positioning System) capabilities into PCB spanning from GNSS (Global navigation satellite system) antenna, ceramic patch, a GPS patch antenna, etc., makes navigation an easy task. These GPS PCBs can be adapted for various applications such as cars, drones, municipal, aviation, and logistics to name a few. Our decade-long-experience in the design and fabrication of different types of PCBs makes us the ideal partner for ensuring your GPS system’s components assembled to your PCB are properly isolated, high reliability of its signal integrity, and that the system as a whole can provide critical positioning information to military, civil, and commercial users.

See also: Aerospace PCBs, Multi Chip Modules, QFN, IC Packaging
Power Devices

High power devices such as battery chargers, converters, heater controls, inverters, power supplies and switches discharge a large quantity of heat during their operations. Providing the customer with an extreme heat dissipation resistant PCB, while utilizing the PCB as a cooling system requires special expertise. PCB Technologies has the relevant know how in choosing the right materials for the job, as well as the stack up structure, plating, and advanced heating management solutions. We conduct route cause analysis on a regular basis to tackle problems such as repeated delamination between PCB layers caused by the extended heat. It takes a lot of experience in PCB design and fabrication to understand the different environmental conditions in which the PCB operates and its influence on the required heat dissipation solution. We believe getting our engineering team involved in the earliest stages of the PCB design, can serve as a game-changer in both time and money spent.

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