Defense

There are numerous types of sensors that require PCB design and fabrication – flow, image, level sensors, light, motion, position and temperature sensors to name a few. All of which rely on heavy-data transmissions and analysis gathered from the environment, manufacturing assets and equipment. Designing PCB for these types of sensors needs to take different parameters into account, such as the environment in which they operate, their form factor, power requirements, to ensure signal and power integrity at all times for their smooth functionality as well as cost, sensitivity, reliability, and rapidity of data. Our expertise in substrate design and fabrication allows for high precision miniaturized sensors applying minimum trace spacing, and width.

PCB Technologies is a world leader in the design and manufacturing of radar PCBs including phased array air cavity antenna designs based on advanced semiconductor technology. This addresses the market’s demand for reduced size, weight, and power consumption of these elements. The next-generation design moves to a flat-panel approach, where each IC is easily mounted on the back of the antenna board allowing large-scale reduction of the antenna’s depth. The integration of higher frequency ICs (GaAs, GaN), makes advanced packaging and thermal management solutions key factor in the production of phased array air cavities to reduce the system’s physical size, improve its long-term reliability, and ensure more than one radiation pattern or data stream as common in conventional dish antennas. We also conduct complex tests and inspection procedures to ensure quality, highly reliable solutions for high reliability and mission-critical applications.

Chip packaging technology has become a key factor enabling smaller, lighter systems with increased functionality. When Radio Frequency integrated circuit (RFIC) chip is placed inside a package and connected to other components, this antenna-in-package (AiP) concept enables the reduction of the overall size and weight of the system and increases its cost efficiency. We at PCB Technologies can give our customers the benefit of a decade-long PCB and PCBA experience to be implemented in miniaturization solutions as well.
Wide range of Application in package adopted by chip developer for high-frequency applications from 60 GHz radios, to automotive radars, to phased arrays, to advanced sensors at 160 GHz up to 20 GHz for special applications.

Other PCB factors, such as compact size, range of power output levels, vibration, and high level of connectivity make PCB manufacturing and design challenging.

See also: Aerospace PCBs, Multi Chip Modules, QFN, IC Packaging

Processing light waves to enhance an image by the use of electrical periscopes, microscopes, telescopes, or cameras while converting electromagnetic waves into visible light is at the core of electro optics instrumentation. The more complex the instrument and its technology-based operation, the more its reliance on high reliability and high speed PCB, in which we specialize.

MEMS (Microelectromechanical systems) are the microscopic building blocks of modern electronics. MEMS device, which contains mechanical moving parts within the package, requires proper layout to ensure the highest performance in a finished product. PCB Technologies’ decade-long-experience in PCB design and fabrication contributes to our capacity to provide solutions for the market’s continued demand for miniaturization of electronic devices. We make sure every parameter related to their design does not go unnoticed such as the components sensitivity to mechanical and thermal stress coming from the PCB they’re assembled to, or the need to reduce PCB signal noise to ensure their smooth operation. We implement high-end technologies on accelerometers, gyroscopes, MEMS microphones, motion and pressure sensor modules, and more.