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High power

Superior heat dissipation, organic substrate and advanced packaging solutions

The ever-growing demand for energy-consuming appliances in our daily lives, creates the need for renewable energy and high-power applications solutions. Just a few examples of that are LED lighting panels and energy-saving GPS technology devices; all of which rely on quality, high reliability, high performance PCBs to manage their performance in various environmental conditions, while using alternative energy resources, such as wind, solar or hydroelectric energy.

We, at PCB Technologies, offer our customers an All-in-One solution to meet these demands.
The greater benefit of this approach materializes if we can get involved in your project from the early stages of your PCB design, through its fabrication, and testing; especially when it comes to organic substrate and advanced packaging solutions, allowing their miniaturization to tiny form factors. Our decade-long experience in thermal management enabling heat dissipation of these high-power components can come in handy when designing your PCB, taking into account, not only the technological aspect but also cost-effectiveness and supply chain constraints.

See also: iNPACK, Slp PCB, Substrate like PCB, Slp Process

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Engineering

Our highly experienced engineering team is at your service – from design to fabrication for an All-in-One solution

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Our sales team will be happy to provide you with a quote. Simply send us an email detailing your requirements and we’ll reply ASAP

Relevant Applications

  • Sensors

    There are numerous types of sensors that require PCB design and fabrication – flow, image, level sensors, light, motion, position and temperature sensors to name a few. All of which rely on heavy-data transmissions and analysis gathered from the environment, manufacturing assets and equipment. Designing PCB for these types of sensors needs to take different parameters into account, such as the environment in which they operate, their form factor, power requirements, to ensure signal and power integrity at all times for their smooth functionality as well as cost, sensitivity, reliability, and rapidity of data. Our expertise in substrate design and fabrication allows for high precision miniaturized sensors applying minimum trace spacing, and width.

  • UAV Interception Systems

     

    Tackling Modern Warfare Challenges

    At PCB Technologies, we are uniquely equipped to tackle the toughest challenges in UAV electronics. From thermal management and EMI compliance to high-speed processing and miniaturization, our advanced IC packaging and turnkey solutions are engineered for peak performance. With decades of expertise in defense and aerospace, we provide UAV designers, manufacturers, and engineers with cutting-edge PCBs, including specialized solutions for drone PCBs and counter UAV systems. PCB Technologies solutions are crafted with  stringent and advanced processes to ensure reliability in extreme environments, seamless multi-sensor integration, and unmatched operational efficiency.

     

    Electronic Warfare

    Laser Directed Energy

    Microwave

    UAV-Drones

     

    Navigating the Complexities of Modern Interception Systems

    • Thermal Management: Effective cooling for high-power electronics.
    • Miniaturization: Reducing size and weight for compact, integrated designs.
    • EMI: Ensuring system compatibility and signal clarity.
    • Broadband Communication Resilience: Maintaining consistent connectivity and jamming resistance.
    • High-Speed Processing: Meeting demands for rapid data processing and response.
    • Vibration and Noise Reduction: Enabling systems stabilization for precise detection and operation.
    • Advanced Materials: Advising designers on optimal PCB and substrate materials to meet requirements.

     

    What Sets Us Apart

    At PCB Technologies, our expertise and innovation establish us as a leader in UAV system electronics. We tackle the toughest challenges in modern UAV development with streamlined production processes across all divisions, ensuring faster time-to-market. By combining advanced miniaturization, cutting-edge materials, and innovative processes, we deliver solutions that overcome thermal management, EMI, and vibration stability challenges in extreme environments—empowering UAV professionals to excel in modern defense applications.

    Whether you’re addressing anti-drone technology requirements or need specialized solutions for electronic warfare systems, we deliver precision, performance, and reliability that meet the demands of modern defense.

     

    We don’t just provide solutions; we partner with you to overcome the unique challenges of UAV development, ensuring your success in today’s competitive landscape.

     

    Take Your System to New Heights

    Ready to elevate your product ? Contact PCB Technologies today and discover how we can help you meet the demands of tomorrow with unmatched precision and innovation.

  • Industry 4.0

    Fully automated factories relying on data automation efficiency and productivity are constantly increasing their utilization of technological advancements made in autonomous robots, big data, and internet of things (IoT), machine learning, simulation, and system integration. The main incentive of industry 4.0 manufacturers is to track down manufacturing errors as they occur. Big volumes of data analysis require highly reliable PCBs which should be tested and process controlled through each of their production stages. Industries 4.0 also requires PCB design which is able to combine RF, advances processors, antennas, miniaturization, optics and advanced technologies into one integrated system. PCB Technologies is the perfect fit in terms of know-how based on long years of PCB manufacturing and design, PCBA and full system integration.

  • Power Devices

    High power devices such as battery chargers, converters, heater controls, inverters, power supplies and switches discharge a large quantity of heat during their operations. Providing the customer with an extreme heat dissipation resistant PCB, while utilizing the PCB as a cooling system requires special expertise. PCB Technologies has the relevant know how in choosing the right materials for the job, as well as the stack up structure, plating, and advanced heating management solutions. We conduct route cause analysis on a regular basis to tackle problems such as repeated delamination between PCB layers caused by the extended heat. It takes a lot of experience in PCB design and fabrication to understand the different environmental conditions in which the PCB operates and its influence on the required heat dissipation solution. We believe getting our engineering team involved in the earliest stages of the PCB design, can serve as a game-changer in both time and money spent.

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