Organic Substrate
Features
1/1mil L/S
Cu pillars
Low CTE
High thermal conductivity
50-80 um via diameter
Fan-in /Fan-out through inserts
Interposer/connector substrates
Types
Rigid or Flex substrates
Organic substrates
Laminate substrates
Build-up substrates
Applications
Medical
Automotive
Aerospace
Power
Communications: high-speed digital
Optical
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