PCB Assembly

Broad Vision

PCB Technologies and its PCB Assembly division (AMS Electronics) provide high-mix high-technology electronic assembly solutions. Our processes and procedures are designed to provide maximum flexibility and quick response to your changing needs.

With a highly experienced technological team we can support the most complex assembly technologies, including: 01005 placement, POP Placements, multi layers boards, complex BGA’s/QFN and more.

We have long years of experience in industrial and consumer electronics products manufacturing to include industrial, and medical products, audio-visual appliances, wireless communications equipment and devices, and computer boards, to name a few.

Backed with state-of-the-art, fully computerized equipment and a highly advanced Information System we take pride in our paperless production floor. Our PCB manufacturing capacity can handle small, medium or large volume production levels.

Standards

Class 3 & 3A

610 PCBA

(Rework & Repair Class 2 commercial Cass 3 Military)

Relevant Services

NPI - New Product Introduction

RMA

Reballing & BGA Replacement

Purchasing

PCB Assembly

Comprehensive Testing Plan - PCBA

DfX/DfM

Full Turnkey

Full System Integration

Shipping

Planning

Relevant Applications

Industry 4.0

Fully automated factories relying on data automation efficiency and productivity are constantly increasing their utilization of technological advancements made in autonomous robots, big data, and internet of things (IoT), machine learning, simulation, and system integration. The main incentive of industry 4.0 manufacturers is to track down manufacturing errors as they occur. Big volumes of data analysis require highly reliable PCBs which should be tested and process controlled through each of their production stages. Industries 4.0 also requires PCB design which is able to combine RF, advances processors, antennas, miniaturization, optics and advanced technologies into one integrated system. PCB Technologies is the perfect fit in terms of know-how based on long years of PCB manufacturing and design, PCBA and full system integration.
MEMS Devices

MEMS (Microelectromechanical systems) are the microscopic building blocks of modern electronics. MEMS device, which contains mechanical moving parts within the package, requires proper layout to ensure the highest performance in a finished product. PCB Technologies’ decade-long-experience in PCB design and fabrication contributes to our capacity to provide solutions for the market’s continued demand for miniaturization of electronic devices. We make sure every parameter related to their design does not go unnoticed such as the components sensitivity to mechanical and thermal stress coming from the PCB they’re assembled to, or the need to reduce PCB signal noise to ensure their smooth operation. We implement high-end technologies on accelerometers, gyroscopes, MEMS microphones, motion and pressure sensor modules, and more.
Power Devices

High power devices such as battery chargers, converters, heater controls, inverters, power supplies and switches discharge a large quantity of heat during their operations. Providing the customer with an extreme heat dissipation resistant PCB, while utilizing the PCB as a cooling system requires special expertise. PCB Technologies has the relevant know how in choosing the right materials for the job, as well as the stack up structure, plating, and advanced heating management solutions. We conduct route cause analysis on a regular basis to tackle problems such as repeated delamination between PCB layers caused by the extended heat. It takes a lot of experience in PCB design and fabrication to understand the different environmental conditions in which the PCB operates and its influence on the required heat dissipation solution. We believe getting our engineering team involved in the earliest stages of the PCB design, can serve as a game-changer in both time and money spent.
UAV Interception Systems

Tackling Modern Warfare Challenges

At PCB Technologies, we are uniquely equipped to tackle the toughest challenges in UAV electronics. From thermal management and EMI compliance to high-speed processing and miniaturization, our advanced IC packaging and turnkey solutions are engineered for peak performance. With decades of expertise in defense and aerospace, we provide UAV designers, manufacturers, and engineers with cutting-edge PCBs, including specialized solutions for drone PCBs and counter UAV systems. PCB Technologies solutions are crafted with stringent and advanced processes to ensure reliability in extreme environments, seamless multi-sensor integration, and unmatched operational efficiency.

Electronic Warfare

Laser Directed Energy

Microwave

UAV-Drones

Navigating the Complexities of Modern Interception Systems

Thermal Management: Effective cooling for high-power electronics.

Miniaturization: Reducing size and weight for compact, integrated designs.

EMI: Ensuring system compatibility and signal clarity.

Broadband Communication Resilience: Maintaining consistent connectivity and jamming resistance.

High-Speed Processing: Meeting demands for rapid data processing and response.

Vibration and Noise Reduction: Enabling systems stabilization for precise detection and operation.

Advanced Materials: Advising designers on optimal PCB and substrate materials to meet requirements.

What Sets Us Apart

At PCB Technologies, our expertise and innovation establish us as a leader in UAV system electronics. We tackle the toughest challenges in modern UAV development with streamlined production processes across all divisions, ensuring faster time-to-market. By combining advanced miniaturization, cutting-edge materials, and innovative processes, we deliver solutions that overcome thermal management, EMI, and vibration stability challenges in extreme environments—empowering UAV professionals to excel in modern defense applications.

Whether you’re addressing anti-drone technology requirements or need specialized solutions for electronic warfare systems, we deliver precision, performance, and reliability that meet the demands of modern defense.

We don’t just provide solutions; we partner with you to overcome the unique challenges of UAV development, ensuring your success in today’s competitive landscape.

Take Your System to New Heights

Ready to elevate your product ? Contact PCB Technologies today and discover how we can help you meet the demands of tomorrow with unmatched precision and innovation.
Radars

Radar PCB design requires, among other things, the use of high-frequency PCB materials, such as, teflon, ceramic, and hydrocarbon. This enables the measurement of the distance between objects blocked by electromagnetic wave travel time that the radars are programmed for. Airborne, grid, naval, or land radars, Phased array, as well as Yagi-Uda radar PCBs, all combine various digital and mixed-signal technologies using very high-frequency microwave signals which call for the special know-how and a common design rules kit we possess.

PCB Technologies is a world leader in the design and manufacturing of radar PCBs including phased array air cavity antenna designs based on advanced semiconductor technology. This addresses the market’s demand for reduced size, weight, and power consumption of these elements. The next-generation design moves to a flat-panel approach, where each IC is easily mounted on the back of the antenna board allowing large-scale reduction of the antenna’s depth. The integration of higher frequency ICs (GaAs, GaN), makes advanced packaging and thermal management solutions key factor in the production of phased array air cavities to reduce the system’s physical size, improve its long-term reliability, and ensure more than one radiation pattern or data stream as common in conventional dish antennas. We also conduct complex tests and inspection procedures to ensure quality, highly reliable solutions for high reliability and mission-critical applications.